- Sol-Gel법을 이용한 알루미나 기판과 동 피복층간의 접착력 특성
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- 김동규,이홍로
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- 한국표면공학회지
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- 1996년|29권 3호|pp.186-194 (9 pages)
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- 한국표면공학회
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- 정기간행물| PDF텍스트
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In this study, ceramic film was coated by a sol-gel process for increasing the adhesion strength between the substrate and copper layer. TEOS and ATSB were used as starting solution of metallic alkoxide. As a result, amorphous-like diffraction pattern after heat treatment at $1200^{circ}C$ was obtained using X-ray diffractometer. The more contants of $Al_2O_3$ gave rise to the futher advanced cracks. A maximum adhesion strength of 250gf was measured under the condition of 30 Wt.% $Al_2O_3$, which is 5 times greater than that of uncoated one of the ceramic film.