황산과 황산구리 수용액을 전해질로 사용하여 다공성 그물구조 금속을 전기화학적으로 제조하였으며, 이때 균질 전착에 영향을 미치는 첨가제 PEG, MPS의 영향에 대해 살펴보았다. 분극실험과 기공의 평균 직경이 $250{mu}m$의 그물구조 전극을 여러장 적층하여 throwing power를 정량화 한 결과, PEG의 경우 분극 초기에 전극에서 탈착됨으로써 오히려 throwing power를 감소시키고 MPS는 500ppm까지 용액 중 첨가량의 증가와 함께 throwing power를 향상시키는 결과를 보였다 또한 MPS와 PEG가 동시에 혼합된 용액에서는 MPS의 효과가 우선적으로 나타나며 PEG의 효과는 무시할 정도였다 그러나 MPS의 첨가는 전착층의 균열을 유도하여 기계적 강도에 좋지 못한 영향을 미치며 균열을 피하려면 50ppm 이하가 적정함을 SEM 관찰을 통해 확인할 수 있었다.
The effect of organic additives such as PEG ind MPS on throwing power have been studied in the fabrication of porous reticular metal by electrodeposition using the mixture of cupric sulfate and sulfuric acid as electrolyte. Both the polarization test and the electrodeposition on the stacked electrodes, mean pore diameter of which was $250{mu}m$, were performed to illustrate the behavior of throwing power quantitatively. As far as PEG was concerned, it lowered throwing power of electrodeposition on the porous electrode used in this work while the addition of MPS up to 500 ppm in electrolyte enhanced throwing power monotonously. When both MPS and PEG were added in electrolyte, the effect of MPS on throwing power was superior to that of PEG. However, the excess addition of MPS was found to cause the defect in mechanical strength of deposit layer. From the result of SEM observation, it could be concluded that less than 50 ppm of MPS in electrolyte was appropriate to avoid the breakage of deposit layer.
