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P형 Bi0.5Sb1.5Te3 박막의 열전 특성에 미치는 두께 및 어닐링 효과
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  • P형 Bi0.5Sb1.5Te3 박막의 열전 특성에 미치는 두께 및 어닐링 효과
저자명
김일호,장경욱,Kim. Il-Ho,Jang. Kyug-Wook
간행물명
한국재료학회지
권/호정보
2004년|14권 1호|pp.41-45 (5 pages)
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한국재료학회
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정기간행물|
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이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

P-type $Bi_{0.5}$$Sb_{1.5}$ $Te_3$ thin films were deposited by the flash evaporation technique, and their thermoelectric properties and electronic transport parameters were investigated. The effective mean free path model was adopted to examine the thickness effect on the thermoelectric properties. Annealing effects on the carrier concentration and mobility were also studied, and their variations were analyzed in conjunction with the antisite defects. Seebeck coefficient and electrical resistivity versus inverse thickness showed a linear relationship, and the effective mean free path was found to be 3150$AA$. No phase transformation and composition change were observed after annealing treatment, but carrier mobility increased due to grain growth. Carrier concentration decreased considerably due to reduction of the antisite defects, so that electrical conductivity decreased and Seebeck coefficient increased. When annealed at 473 K for 1 hr, Seebeck coefficient and electrical conductivity were $160mu$V/K and 610 $W^{-1}$ $cm^{ -1}$, respectively. Therefore, the thermoelectric quality factor were also enhanced to be $16mu$W/cm $K^2$.>.