The light guide plate has become the major component for the backlight module in general information technology products (e.g. mobile phones, monitors, etc.). High speed injection molding has been adopted for thin walled LGP giving advantages such as weight, shape, size, and reduction in production costs. In the current study, the rheological characteristics of high liquidity plastic resin PC(HL8000) were measured using a capillary rheometer to improve the reliability of the numerical analysis for high speed injection molding. With the measured viscosity and PVT of PC(HL8000), numerical analysis of injection molding was conducted using the simulation software(Moldflow). Filling time and deflection were predicted and compared with those of traditional PC resins(H3000, H4000). The results show that PC(HL8000) has significantly different rheological characteristics during high speed injection molding. Hence proper properties of the resin should be used to improve the accuracy of numerical predictions.