This study investigated the effects of Silicoating procedure on the tensile bond strength of resin-bonded prostheses. The Rexillium III specimens were treated with electrochemical etching and Silicoating procedure, followed by thermocycling and the NNB, Pors-on 4, and Degudent-U specimens were treated with Silicoating procedure. The specimens were debonded in tension with a Tensilon machine. Also, all specimens were observed with SEM, concentration of Si elements was analyzed with EPMA, and the mode of failure was recorded. The results of this study were obtained as follows: 1. In the Rexillium III specimens, the tensile bond strength of the Silicoated specimens was higher than that of the electrochemically etched specimens, and significant differences were observed (P<0.05). 2. The tensile bond strength of electrochemically etched Rexillium III specimens, significant differences were observed between the thermocycled and nonthermocycled specimens (P<0.05), but no significant differences were observed in the Silicoated specimens (P>0.05). 3. The tensile bond strength of the Silicoated specimens decreased NNB, Pors-on 4, Rexillium III, and Degudent-U in that order named. 4. Unlike the electrochemically etched specimens, the Silicoated specimens showed gap-free metal-resin interfaces with SEM. 5. Compared to the electrochemically etched specimens, the Silicoated specimens showed higher concentration of Si elements at the metal-resin interfaces and resin cement. 6. Photographic evaluation (X2) of the fractured sites revealed mainly cohesive failures with the Silicoated specimens, and adhesive failures with the electrochemically etched specimens.