For the reliability analysis of Sin/Hip silicon nitride, such as Weibull modulus m, scale parameter $sigma$0, and Batdorf crack density coefficient kB were obtained by 4-point MOR test. And its theoretical failure probabilities under arbitrary stress state were predicted using finite element analysis and KARA II reliability analysis program, which was programmed for both surface adn volume flaws. For the verification of this theoretical results, the experimental failure probabilities were measured using ring-to-ring tests at room temperature as well as 4-point MOR tests at 100$0^{circ}C$, and were compared with theoretical failure probabilities.