The purpose of this study were to comfirm the effects of the thickness and kinds of porcelain, etchants, illumination time, elapsed time for the measurement, and chemical cure component to the bond strength of porcelain laminate and composite resin cement, and to compare the effects between the light cured resin and the dual cured resins. The etched porcelain surface, the sectioned surface crossing porcelain and resin after bonding, and the debonded surfaces were observed by the SEM. One product of laminate porcelain powder, one light cured resin and two dual cured resins were selected. Each resin cements are lightened through the thin porcelain disc which was cut from cylindrical porcelain specimen by the diamond saw, and by the light through the porcelain disc they were bonded. Changes of thickness and kinds of porcelain, etchants, illumination time, and the elapsed time for the measurement were considered as variables for the bond strength. And the bond strength of porcelain and dual cured resins under the conditions of autopolymerization or the removal of chemical cure component were measured and compared. Bond strength were measured by shear stress. The etched surface, the cross-sectioned surface, and the debonded surface of porcelain or resin were observed by SEM. On the summary of this study, the following conclusions can be stated; 1. Bond strength of light cured resin was decreased inversely by the thickened porcelain laminate and showed the lowest value to the masking dentin porcelain among 4 kinds of porcelain powder. 2. Bond strength of autopolymerization of dual cured resin without illumination in dark chamber were from 75% to 98% to the data of dual cured resin with illumination. 3. Bond strength of dual cured resin used without chemical cured components were same to them of light cured resin. 4. Cross-sectioned surface treated by silane did not show the gap between the porcelain and resin. 5. Illumination over 80 seconds did not make the significant increase of bond strength on all kinds of resin.