- Al 판재의 Adhesion Bonding에 미치는 전처리 영향
- ㆍ 저자명
- 한성호,김만,장도연,노병호
- ㆍ 간행물명
- 한국표면공학회지
- ㆍ 권/호정보
- 1992년|25권 2호|pp.97-102 (6 pages)
- ㆍ 발행정보
- 한국표면공학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
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Transimission electron microscope(TEM)/ultramicrotomy were used to characterize the detailed surface morphology of 2024-T3 Al alloy surfaces prepared by various pretreatment process. It was found that, for good and superior initial adhesive strength and durability, chemically pretreated substrates appeared essential. The film morphology developed after CSA etching treatment, ass revealed by TEM, suggested the present of irregular cell pattern with finely separated whisker-like protrusion with was responsible for increase of bond strength.