The effect of gelatine on the electrodeposition of copper in cupric sulfate-sulfuric acid solution was investi-gated using an ac impedance technique. In the presence of gelatine, the charge transfer resistance was in-creased and the electrical double layer capacitance was decreased. A model was suggested to explain the im-pedance spectra and it fitted well the experimental data. Also the uniformity of deposit thickness was in-creased while the grain size was decreased by the addition of gelatine.