High temperature tensiles tests, steady state creep tests, internal stress tests and creep rupture tests using Al 7075 alloy were performed over the temperature range of 9$0^{circ}C$~50$0^{circ}C$ and stress range of 0.64~17.2(kgf/$ extrm{mm}^2$) in order to investigate the creep behavior and predict creep rupture life From the apparent activation energy Qc and the applied stress exponent n measured, at the temperature range of 9$0^{circ}C$~l2$0^{circ}C$, the creep deformation seemed to be controlled by cross slip. On the other hand at the temperature of 20$0^{circ}C$~23$0^{circ}C$ the creep deformation seemed to be controlled by dislocation climb but at 47$0^{circ}C$~50$0^{circ}C$, by diffusion creep. And the rupture life(t$_{f}$) might be represented by anthermal process attributed to the difference of the applied stress dependence of Internal stress and the ratio of the Internal stress to the applied stress, the thermal activated process attributied to the temperature dependence of the internal stress. Also the ratio between stress dependence of primary creep rate and that of minimum creep rate was measured 0.46, the minimum creep rate is expected to be appromately obtained from master creep curve including the relationship primary creep rate and minumum creep rate. Finally the relationship new rupture parameter and logarithmic stress was represented with including the ratio between the dependence of primary creep rate and that of minimum creep rate, using the new rupture parameter the rupture life predition is exactly expected.d.