Recently, alumina/glass composites have been applied as a substrate material for hybrid IC and LSI multi-chip packaging. In this study, the characterization of sodium borosilicate glasses containing NaF and $AlF_3$ and the preparation of the resulted glass/alumina composites have been examined and the effect of the addition of fluorides on the thermal. and dielectric properties of the sintered composites have been studied. The sintering temperature of specimens was lowered by about 100-$150^{circ}C$ by the addition of fluorine compared with the specimens without fluorine. The specimens containing fluorine showed slightly lower dielectric constants than those of the specimens without fluorine.