In this study, the degree of radiation damage and contamination on silicon surface has been investigated for MICP(magnetized inductively coupled plasma)- etched silicon as functions of magnetic field strength(0~18 Gauss) and post-treatments. As the applied axial magnetic field strength increased, C/F ratio and thickness of polymer film were increased while surface damage was decreased. The damage and furnace annealing and $O_2$ plasma cleaning, respectively.