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Feature Scale Simulation of Selective Chemical Vapor Deposition Process
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  • Feature Scale Simulation of Selective Chemical Vapor Deposition Process
  • Feature Scale Simulation of Selective Chemical Vapor Deposition Process
저자명
Yun. Jong-Ho
간행물명
韓國眞空學會誌
권/호정보
1995년|4권 |pp.190-195 (6 pages)
발행정보
한국진공학회
파일정보
정기간행물|ENG|
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이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
서지반출

기타언어초록

The feature scale model for selective chemical vapor deopsition process was proposed and the simulation was performed to study the selectivity and uniformity of deposited thin film using Monte Carlo method and string algorithm. The effect of model parameters such as sticking coefficient, aspect ratio, and surface diffusion coefficient on the deposited thin film pattern was improved for lower sticking coefficient and higher aspect ratio. It was revealed that the selectivity loss ascrives to the surface diffusion. Different values of sticking coefficients on Si and on SiO2 surface greatly influenced the deopsited thin film profile. In addition, as the lateral wall angle decreased, the selectively deposited film had improved uniformity except the vicinity of trench wall. The optimum eondition for the most flat selective film deposition pattern is the case with low sticking coefficient and slightly increased surface diffusion coefficient.