In order to rpovide proper SMT design criteria in a systematic way, a mathematical formulation has been developed to predict the configuration of the solder fillet formed between the gullwing type lead and rectangular pad. Effects of SMT design parameters such as the solder volume and pad dimension on the solder profile are investigated using the FEM that calculates the 3D configuration by minimizing the energy due to surface tension and gravity in the equilibrium state. Design criteria of QFP and SOP are illustrated by plotting the acceptable range of the solder volume with respect to the length and width ratios of the pad and lead. The results show that the acceptable design range increases with increase in the pad length and width. The pad length has more significant effects on design criteria compared with the pad width, and Bond number can be utilized to predict the joint quality.