This investigation was performed to collect fundamental informations concerning the behavior of glass solders on ceramic joining process. The wettability of glasses on two types of alumina was evaluated by sessile drop method. SiO$_2$-CaO-Al$_2$O$_3$system glasses were selected as solder glasses, and alumina that have different purities were used for substrate materials. It is indicated that contact angles of glasses on 99% purity of alumina substrate do not change as increasing time at elevated temperature, however the contact angles on the 92% purity of alumina substrate exhibit the strong time dependency. The time-dependent property on 92% alumina was due to the interlayer reactions occurred between the glass solder and impurities on the substrate.