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Development of Tungsten Dispersed Copper Based Alloy and its Physical Property
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  • Development of Tungsten Dispersed Copper Based Alloy and its Physical Property
  • Development of Tungsten Dispersed Copper Based Alloy and its Physical Property
저자명
Mishima. Akira,Sakaguchi. Shigeya
간행물명
한국분말야금학회지
권/호정보
1998년|5권 4호|pp.329-333 (5 pages)
발행정보
한국분말야금학회
파일정보
정기간행물|ENG|
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이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

Copper-10 wt. % tungsten alloyed powder was obtained by co-reduction of mixed tungsten-trioxide and copper oxide powders at 973 K for 7.2 Ks. In the alloy obtained by pressure-assisted sintering of this co-reduced powder, ultra fine tungsten particles (about 100nm) were dispersed uniformly in the copper matrix. At room temperature, the hardness of this alloy was Hv151 and the electrical conductivity was 85% IACS. After annealing at 1173 K for 3.6 Ks, the hardness and electrical conductivity were Hv147 and 84% IACS, respectively, and were same as before annealing. It was confirmed that the hardness and electrical conductivity of this alloy were hardly influenced by annealing condition since the microstructure of this alloy is highly stabilized.