Since the surface diffusion processed $Nb_3Sn$ superconducting tape has the advantage of having large overall critical current density. it is used for the construction of open type MRI superconducting magnets. However one of the disadvantages of this tape is that $Nb_3Sn$ compound often exhibited multiple cracking due to its intrinsic brittleness when subjected to mechanical loading such as bending and winding during the fabrication process for superconducting coil. This will eventually cause the severe degradation of critical current density. Therefore it is important to understand the microscopic deformation behavior of this kind of superconducting tape under the mechanical loading.In this study, acoustic emission(AE) was used to clarify microscopic deformation behavior at room temperature for $Nb_3Sn$ superconducting tape which was strengthened and stabilized with copper. For this purpose, special attention was paid to AE characteristics including AE event, energy, and amplitude distribution which were associated with microscopic mechanism of deformation of $Nb_3Sn$ superconducting tape under tensile load.