- Plating of Permalloy Using Flow Cell
- Plating of Permalloy Using Flow Cell
- ㆍ 저자명
- Jeon. S.H.,Ahn. J.H.,Kang. T.
- ㆍ 간행물명
- 한국표면공학회지
- ㆍ 권/호정보
- 1999년|32권 3호|pp.423-427 (5 pages)
- ㆍ 발행정보
- 한국표면공학회
- ㆍ 파일정보
- 정기간행물|ENG| PDF텍스트
- ㆍ 주제분야
- 기타
Electroplating of 80%Ni permalloy thin plate for magnetic core materials. was studied The convected flow of electrolyte was used for stirring methode. The current density could be increased up to 250mA/$ extrm{cm}^2$ by flow cell. The composition of electroplated layer with vespect to current density and flow rate was investigated and experimental equation to predict the composition was made. How cell yielded more uniform thickness distribution than paddle cell did. The composition distribution was also studied. The thickness was the most important factor to the permeability. The permeability of 5$mu extrm{m}$plated permalloy was over 2000 at 1 MHz.