The hardness and elastic modulus of three bulk materials are computed from the load and displacement data which are measured during basic nanoindentation test and compared with values determined by independent means to assess the accuracy of the method. The results show that with this technique, modulus and hardness and elastic modulus profile through depth of silicon nitride and silicon oxynitride films. The results show that for silicon nitride film deposited on silicon, hardness and elastic modulus increase as the volume ratio of NH3 : SiH4, which had been used for deposition, increases up to 20.0; and for silicon oxynitride film on silicon, the hardness and elastic modulus profile changes distinctly as the relative amount of oxygen in deposition gas mixture changes.