Ultrasonic pulse echo method comes to be difficult to apply to the multi-layered structure with very thin layer, because the echoes from the top and the bottom of the layer are superimposed. We can easily meet this problem when the silicon chip layer in the semiconductor is inspected by a SAM equipment using fairly low frequency lower than 20MHz by which severe attenuation in the epoxy mold compound of packaging material can be overcome. Conventionally, deconvolution technique has been used for the decomposition of superimposed UT signals, however it has disabilities when the waveform of the transmitted signal is distorted according to the propagation. In this paper, the wavelet transform based deconvolution(WTBD) technique is proposed as a new signal processing method that can decompose the superimposed echo signals with superior performances compared to the conventional deconvolution technique. WTBD method uses the wavelet transform in the pre-stage of deconvolution to extract out the common waveform from the transmitted and received signal with distortion. Performances of the proposed method we shown by through computer simulations using model signal with noise and we demonstrated by through experiments for the fabricated semiconductor sample with partial delamination at the top of silicon chip layer.