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A qualitative analysis of bonding between electroformed surface and veneering ceramics
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  • A qualitative analysis of bonding between electroformed surface and veneering ceramics
  • A qualitative analysis of bonding between electroformed surface and veneering ceramics
저자명
Kwon. Ho-Beom,Yim. Soon-Ho
간행물명
대한치과보철학회지
권/호정보
2000년|38권 3호|pp.328-335 (8 pages)
발행정보
대한치과보철학회
파일정보
정기간행물|ENG|
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이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

Statement of the problem. Recently an innovative method of fabricating indirect restorations by gold electroforming has been developed. But the bond quality and strength of the gold coping to the porcelain is uncertain. Purpose of study. The purpose of this study is to analyze and evaluate the electroformed gold surface for mechanical bonding between the gold and the ceramic veneering. Methods/material. Electroformed disks were made using electroforming technique. And the surface of the electroformed coping was analyzed after sandblasting, heat-treatment, bonding agent application, opaque porcelain firing with scanning electron microscopy and energy dispersive x-ray analysis. Results. In the analysis with SEM, Sandblasting made the sharp edges and undercuts on the electroformed surface, and after bonding agent application, net-like structure were created on the electroformed surface. In the energy dispersive x-ray analysis it is confirmed that electroformed surface contains some impurities. Conclusion. With the use of sandblasting and bonding agent, electroformed surface seems to be enough to bond with veneering porcelain.