The experiments were conducted by using water and paraffin slurry to investigate the effect of a chip spacing in the multichip module on the cooling characteristics from an in-line $4{ imes}3$ array of discrete heat sources which were flush mounted on the top wall of a channel. The experimental parameters were chip spacing in a multichip module, heat flux of simulated VLSI chip, mass fraction of paraffin slurry, and channel Reynolds number. The removable heat flux at the same chip surface temperature decreased as the chip spacing decreased at the first and fourth rows. The local heat transfer coefficients for the paraffin slurry were larger than those for water, and the chip spacing on the local heat transfer coefficients for paraffin slurry influenced less than that for water. The enhancement factor for paraffin slurry showed the largest value at a mass fraction of 5% regardless of the chip spacing, and the enhancement factors increased as the chip spacing decreased. This means that the paraffin slurry is more effective than water for cooling of the highly integrated multichip module.