Continuing efforts to achieve increased circuit performance in electronic package have resulted in higher power density at chip and module level. As a result, the thermal management of electronic package has been important in maintaining or improving the reliability of the component. An experimental investigation of thermosyphonic boiling in vertical tube and channel made by two parallel rectangular plates was carried out in this study for possible application of the direct immersion cooling. Fluorinert FC-72 as a working fluid was used in this experiment. Asymmetric heated channel of open periphery with gap size of 1, 2, 4 and 26mm and uniformly heated vertical tubes with diameter of 9, 15 and 20mm were boiled at saturated condition. The boiling curves from tested surfaces exhibited the boiling hysteresis. It was also found that the gap size is not a significant parameter for the thermosyphonic boiling heat transfer with this Fluorinert. Rather pool boiling characteristics appeared for larger gap size and tube diameter. The heat transfer coefficients measured were also compared with the calculation results by Chens correlation.