Effect of ultrasonic agitation on Pd catalyst treatment was studied in metallization of ceramic boards by Cu electroless plating method.96% $Al_{2}$$O_{3}$ ceramic boards were used as substrate. In this study, the ultrasonic frequency of 28kHz was applied. In Pd catalyst, high density Pd nuclei of small size were formed during ultrasonic agitation. Density of Pd was more improved when using of ultrasonic then no stirring. In electroless plating, plating rate was in the range of 0.6~1.8$mu extrm{m}$/hr, which value increased with Rochelle Salts addition. Adhesion strength between ceramic boards and Cu layer was improved of 20% when using ultrasonic agitation at $30^{circ}C$ ,5min.