Recently, the mechanical structures applied to many industrial products, especially in electronic products, appear to be miniaturized and complicated. This trend makes it difficult to analyze the stress distribution of those mechanical structures and generates new challenges for precise measurement of strain. In order to solve this measurement problem many optical measurement techniques have been suggested. Among those, the ESPI(Electronic Speckle Pattern Interferometry) has been considered as one of the most useful tools. But the shortage of recognition and difficulties of measurement have limited its industrial applications in spite of its excellent capabilities. Therefore in this study, not only the verification of the FEA result but the enhancement of industrial application of ESPI was tried by measuring the in-plane displacement of mechanical structure with ESPI, which is difficult to be measured with strain gauge.