The soldering is widely used installing the electronic element on circuit board in the common electronic device. Since the flux which improves the liquidity of solder make the electronic and chemical performance worse, the circuit board need to wash clearly. At present however no-washing is required for the cost reduction, the chemical stability, and the protection of environment. In this research, the solder liquidity depending on the power density and the pulse width is comparatively analyzed by the diffusion area method for achieving the no-flux soldering.