DIMM(dual inline memory module) is widely employed in personal computers. The maximum warpage of the injection molded connectors should be minimized to be compatible with SMT (surface mount technology) process. CAE(computer aided engineering) simulation of thin-wall injection molded parts was investigated using commodity thermotropic and thermotropic liquid crystal polymers. During the filling phase in injection molding, the shape of the viscosity distribution across the cavity is a consequence on both shear rate and temperature. Cooling stage affects many parameters of the process This research deals with the development of an efficient for mulation for numerical, by which problem involving thin complex injection molded products (DIMM soket) can be solved to predict residual strees, shrinkage, and warpage.