- 공기온도가 열전도성 기판 위에 탑재된 군용 전자칩 냉각에 미치는 영향
- ㆍ 저자명
- 이진호
- ㆍ 간행물명
- 韓國軍事科學技術學會誌
- ㆍ 권/호정보
- 2002년|5권 2호|pp.195-206 (12 pages)
- ㆍ 발행정보
- 한국군사과학기술학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
The conjugate heat transfer from the simulated module in a horizontal channel with the variation of inlet air temperature is experimentally investigated. The aim of this study is to estimate temperature difference between a module and inlet air. This study is performed with the variation of parameters that are inlet air temperature(Ti=25~$55^{circ}C), thermal resistance( $R_c$=0.05, 4.11, 158 K/W), inlet air velocity(Vi=0.1~1.5m/s), and input power(Q=3, 7 W). The results show that the effect of inlet air temperature is little, at the case of using conductive board. And input power was most effective parameter on the temperature difference between module and Inlet air.