Recently, the authors have developed a new material test system fur thin film at the high temperature. It is so compact and precise with sub micron resolution that it seems to be a useful tool fur research of the oxide film growth, its mechanical behavior and failure mechanism. To this end. in this paper three methologies are described for in-situ monitoring of the displacement & strain and the temperature, the oxide thickness. These are the Laser Speckle analysis with digital image correlation technique, the two-color infra-red thermometer and the laser reflection interferometry respectively. The calibration results and some issues which should be addressed for practical application are presented.