Effects of the circular and non-circular pad shapes on self-alignment in BGA soldering are predicted using Surface Evolver, and the calculated results are compared with experimental data. While the pad shape has minor effects on self-alignment in the vertical direction, self-alignment in the lateral direction depends on the pad direction and length ratio of the non-circular pad. Larger restoring force is obtained in the minor-axis direction than the major-axis direction, which suggests a possibility of reducing misalignment in the specific direction. The restoring force of the circular pad is between those of the non-circular pad in the major and minor-axis directions. The calculated results of Surface Evolver show reasonably good agreements with experimental data using the shear loading system.