Thermal management is very important for the success of high density circuit design in LTCC. In this paper, LTCC substrates containing thermal via and pad were fabricated in order to study the influence of the thermal dissipation. To realize the accurate thermal analysis for structure design, a series of simple thermal conductivity measurement by laser flash method and parametric numerical analysis have been carried out. The LTCC substrate including via and Ag pad has good thermal conductivity over 103 W/mK which is 44% value of pure Ag material. Thermal behaviors with via arrays, size and density in the LTCC substrate were studied by numerical method.