Domain switching effect on crack growth in ferroelectric ceramics under combined electric and mechanical loading is investigated. The shape and size of the switching zone is shown to depend strongly on the relative magnitude between the applied electric field and stress field as well as on the ratio of the coercive electric field to the yield electric field. The toughening mechanism is thought to be ferroelectric domain switching leading to the development of a process zone around the crack. Crack-tip stress intensity factor induced by domain switching for the steady state crack growth is numerically obtained.