In the precision hot plate for wafer processing, uniform temperature of the upper plate is one of key factors affecting the quality of wafers. The state-of-the-art precision hot plates require temperature Variations less than $pm$0.4$^{circ}C$ during heating to 15$0^{circ}C$, Which is difficult to be obtained only by the improvement of manufacturing techniques alone. In this study, computer aided heat transfer analysis was carried out to obtain the temperature distribution of the currently used reference hot plate for 200mm wafer. The analysis on the reference model assuming constant heat generation rate and uniform heating area showed total variation of 0.926$^{circ}C$ at 15$0^{circ}C$. One of the new design approaches based on the change of heating location together with different heat generation rate resulted in total variation of 0.297$^{circ}C$ which is a 68% improvement compared to that of the reference model.