Palladium was recovered from Pd leaching solution by an electrochemical method. The electrochemical behavior of Pd deposition were studied in 6M HCl solution containing Pd. The effects of current density and temperature on the morphology and stress of Pd electrodeposit were studied. A batch-type recovery of bulk Pd deposit was also done in the solution. The morphology of Pd deposit was significantly affected by current density and temperature. The dense Pd deposit obtained below 4$0^{circ}C$ showed high stress level regardless of current density and temperature. Raising the temperature over 55$^{circ}C$ resulted in dense and lower stressed deposit. The decrease of Pd concentration during the batch-type process lowered the current efficiency of Pd deposition. Dense Pd deposits of 6 cm$^2$ could be obtained at 7$0^{circ}C$ without considerable deformation of deposit.