On this study, an E.E(End-Effector) for the 300 mm wafer transfer robot system is newly suggested. It is a mechanical type with $180^{circ}$ rotating ranges and is composed of 3-point arms, two plate springs and single-axis DC motor controlled by microchip. To design, relationship between the gripping force and the wafer deformation is analyzed by FEM. By analytic results, the gripping force for 300 mm wafer is confirmed as 255~274 gf. From experimental results on gripping force, repeatable position accuracy and gripping cycle times in a wafer cleaning system, we confirmed that the suggested E.E was well designed to satisfiy on the required performance for 300 mm wafer transfer robot system.