The electric resistance and constant current were investigated on the nickel-thallium-phosphorus alloy deposits by electroless-plating. The Ni-Tl-P alloy deposits were achieved with a bath using sodium hypophosphit as the reducing agent and sodium citrate as the comlexing agent. The basic plating solution is composed of 0.1M NiSO$_4$, 0.005${sim}$0.0IM Tl$_2$S0$_4$, 0.1${sim}$O.2M sodium hypophosphite and 0.02${sim}$O.IM sodium citrate and the plating condition were pH 5${sim}$6, temperrature 80$_4$90${circ}$C. The results obtained are summarized as follows: 1) The crystal structure of deposit was amorphous structure as deposited state, became microcrystallized centering on Ni(111) plane by heat treatment at 200${circ}$C, and grew as polycrystalline Ni, Ni$_3$P, Ni$_5$p$_2$,Tl, etc. by heat treatment higher than 350${circ}$C. The grain size of plated deposits was grown up to 28.3~42.0nm by heat treatment for 1hour at 500${circ}$C. 2) The electrical resistivity showed a comparatively high value of 192.5$_4$208.3 ${mu}$${Omega}$Cm and its thermal stability was great with resistivity value less than 0.22% in the thermal surroundings of 200${circ}$C. 3) Ni-Tl-P alloy deposit showed such good constant current-making-effect in the variation of electric voltage, heat treatment temperature, and the composition of the deposit that it can be put to practical use as the matter of constant current device.