All-in-one adhesives were recently developed for reducing the technique sensitivity and chair time, but lots of concerns were made on bondability, longevity, and microleakage. The object of this study was to evaluate microleakage and marginal quality of all-in-one adhesives using electrochemical method and SEM analysis quantitatively. After making Class V cavities, they were bulk filled with Heliomolar(#A1 after surface treatment with three adhesives: Adper Prompt (Group A), One up bond F (Group O), Xeno III (Group X) Electrical conductivity (microamphere, ${mu}A$) was checked two times: before and after cavity filling. Percentage of leaky margin was estimated from SEM image (${ imes}1,000$). The data were statistically analysed: ANOVA and Paired T test for electrical conductivity, Kruskal-Wallis and Mann-Whitney test for marginal quality, Spearman s rho test for checking of relationships between 2 methods. The result were as follows: 1. There was no difference in microleakage between adhesive systems and every specimen showed some of microleakage after filling. 2. Microleakage was reduced about 70% with composite resin filling. 3. Marginal quality was the best in group A. decreasing among groups in the following order: group O, followed by group X. There were significant differences between group A and group X (p=0.015), and between group 0 and group X (p=0.019). 4. There was no relationship between the microleakage measured by electrochemical method and marginal quality measured by SEM analysis. Within the results of this study, there was no difference in microleakage among groups by electrical conductivity. However, significant difference in marginal quality was seen among groups. It was believed that these dissimilar results might be induced because of their own characteristics. Analysis of microleakage needs various methods for accuracy.