- 초음파 진동을 이용한 세라믹 소재의 마이크로 홀 가공
- ㆍ 저자명
- 박성준,이봉구,최헌종
- ㆍ 간행물명
- 한국공작기계학회논문집
- ㆍ 권/호정보
- 2004년|13권 2호|pp.104-111 (8 pages)
- ㆍ 발행정보
- 한국공작기계학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
Ultrasonic machining is a non-thermal, non-chemical, md non-electorial material removal process, and thus results in minimum modifications in mechanical properties of the brittle material during the process. Also, ultrasonic machining is a non-contact process that utilize ultrasonic vibration to impact a brittle material. In this research characteristics of micro-hole machining for brittle materials by ultrasonic machining(USM) process have been investigated. And the effect of ultrasonic vibration on the machining conditions is analyzed when machining fir non-conductive brittle materials using tungsten carbide tools with a view to improve form and machining accuracy.