Techniques and procedures are presented for measuring mechanical properties on thin-film Polysilicon. Narrow platinum lines are deposited 250 ${mu}{ extrm}{m}$ apart on tensile specimens that are 3.5 ${mu}{ extrm}{m}$ thick and 600 ${mu}{ extrm}{m}$ wide. Load is applied by a piezo-actuator and by hanging weights. Strain is measured by an ISDC at temperatures up to 500 $^{circ}C$. Measurements of the elastic modulus with jig modifications, loading speed and temperature change are presented first. And then, the preliminary data for the coefficient of thermal expansion and creep behavior are presented as a reference.