Performing the sensitivity analysis of contact conduction on the basis of the thermal model already established, the study of thermal design is accomplished for the preparation of the future changes of mechanical interface design. A relatively simple thermal model is taken into consideration for the convenience of the analysis. A variety of the spacecraft bus voltages and the contact resistances are tried. As a consequence, when the mechanical interface condition is changed at the same module, the successful thermal design could be achieved if we design the heater to have sufficiently large power with reference to the heritage of contact resistance.