- 깊은 구멍 가공을 위한 가공액 초음파 가진 미세 방전가공
- ㆍ 저자명
- 제성욱,이해성,주종남,김덕환,Je. Sung Uk,Lee. Hae Sung,Chu. Chong Nam,Kim. Duck Whan
- ㆍ 간행물명
- 한국정밀공학회지
- ㆍ 권/호정보
- 2005년|22권 7호|pp.47-53 (7 pages)
- ㆍ 발행정보
- 한국정밀공학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
Microholes with high aspect ratio are required in microstructures. Among various methods for producing the microhole, micro electrical discharge machining (MEDM) is very effective and useful process. But, it is difficult to machine the high aspect ratio holes below $100;{mu}m$ in diameter because machining condition becomes unstable due to bad removal of debris at deep hole. In this paper, ultrasonic vibration is applied to MEDM work fluid to make a high aspect ratio micro hole. It is shown that the vibration is effective in circulating the debris and increasing the machining rate. As a result, produced was a micro hole with $92;{mu}m$ entrance diameter, $81;{mu}m$ exit diameter and aspect ratio 23.