The plating shape in the opening of photoresist becomes gradated shape in the fountain plating system, because bubbles from the wafer surface are difficult to escape from the deep openings, vias. In this paper, the bubble flow from the wafer surface during plating process was studied and we designed the tilted electrode ring to get uniform bump height on all over the wafer and evaluated the film uniformity by SEM and $alpha-step$. In a-step measurement, film uniformities in the fountain plating system and the tilted electrode ring contact system were $pm16.6\%,;pm4\%$ respectively.