기관회원 [로그인]
소속기관에서 받은 아이디, 비밀번호를 입력해 주세요.
개인회원 [로그인]

비회원 구매시 입력하신 핸드폰번호를 입력해 주세요.
본인 인증 후 구매내역을 확인하실 수 있습니다.

회원가입
서지반출
Numerical Study of SF6 arc with Copper Contamination
[STEP1]서지반출 형식 선택
파일형식
@
서지도구
SNS
기타
[STEP2]서지반출 정보 선택
  • 제목
  • URL
돌아가기
확인
취소
  • Numerical Study of SF6 arc with Copper Contamination
  • Numerical Study of SF6 arc with Copper Contamination
저자명
Liau. Vui-Kien,Lee. Byeong-Yoon,Song. Ki-Dong,Park. Kyong-Yop
간행물명
KIEE international transactions on electrophysics and applications
권/호정보
2005년|6호|pp.233-241 (9 pages)
발행정보
대한전기학회
파일정보
정기간행물|ENG|
PDF텍스트
주제분야
기타
이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
서지반출

기타언어초록

The present model of a SF6 arc accounts for the copper vapour contamination from the electrodes inside a Laval nozzle of a circuit breaker. Steady state simulations have been done for the arc with electrode gap of 60mm and DC electric current of 500A, 1000A and 1500A for both cases with and without copper contamination. The effects of electrode polarity are considered for the arc current of 1000A. It was found out that evaporation of copper from the anode results in a cooling of the arc in a region close to the electrodes. The electrical potential across the electrodes is not sensitive to the presence of copper vapour, typically less than $4\%$ difference. Transient analysis has been done in order to obtain the arc properties at current zero. The arc current is increased linearly from -1000 to 0A when the upstream electrode is cathode with constant dI/dt of $27.0A/{mu}s$ (or decreased linearly from 1000 to 0A when upstream electrode is anode). It has been predicted that the presence of copper vapour reduces the interruption capability of the breaker.