- ESPI를 이용한 전자제품 패키지 열변형 신뢰성 평가에 관한 연구
- ㆍ 저자명
- 조지현,이재혁,박상영,장중순,김광섭,Cho. Ji-Hyun,Lee. Jae-Hyuk,Park. Sang-Young,Jang. Joong-Soon,Kim. Gwang-Sub
- ㆍ 간행물명
- 신뢰성응용연구
- ㆍ 권/호정보
- 2005년|5권 4호|pp.439-450 (12 pages)
- ㆍ 발행정보
- 한국신뢰성학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
Thermal deformation of Digital Television effect friction noise directly. However there was no methods to find and to solve the thermal friction noise which is huge problem in Digital Television In this study, to figure out occurrence cause of friction noise of the product, we measured thermal deformation of the product to organize a triggering device united with Laser Doppler Vibrometer(LDV) which turned occurrence moment of thermal friction noise into a possibility to measure. In conclusion, we could offer an effective information of design, and ensured ESPI(Electronic Speckle Pattern Interferometry) measure technique which is more detailed than the past way.