An oxygen free copper severely-deformed by eight cycles (an equivalent strain of $~6.4$) of accumulative roll-bonding (ARB) was annealed at various temperatures ranging from 100 to $300^{circ}C$. The annealed copper was characterized by transmission electron microscopy (TEM) and tensile & hardness test. TEM observation revealed that the ultrafine grains developed by the ARB still remained up to $150^{circ}C$, however above $200^{circ}C$ they were replaced by equiaxed and coarse grains due to an occurrence of the static recrystallization. Tensile strength and hardness of the copper decreased slightly with the annealing temperature up to $150^{circ}C$, however they dropped largely above $200^{circ}C$. Annealing characteristics of the copper were compared with those of a commercially pure aluminum processed by ARB and subsequently annealed.