In this paper, a new polishing head with the variable pressure structure was studied to improve the planarization uniformity of the conventional template-metal head. Metal surface waviness and slurry distribution on the pad have been known to affect the polishing uniformity even in the synchronized quill and platen velocities. A polishing head with silicon rubber sheet was used to get a curved pressure distribution. In the experiment, the vertical deflection behavior on the pad was characterized with back pressure in the air chamber. Quill force increased linearly with backpressure. However, backpressure under a quill force made the upward movements of the quill. In the wafer polishing experiments, polishing rate and polishing thickness distribution were severely changed with backpressure. The best uniformity was observed with the standard deviation off.5％ level of average polishing removal 215nm at backpressure 12.1kPa.