The contents of mobile phones are rapidly appended and the structures are being changed substantially. Most of the problems with mobile phones are related with the vibrations and the displacements of PCB boards. In this study, the vibration magnitudes of the boards by impulses on the case are analyzed with the variations of the selected design parameters. The result shows that the extensive suppression of the vibrations are feasible by the proper selection of the design parameters. Also the suggested relationships between the parameter selections and the magnitudes of vibrations can be applied to establish a database for improved stability of the mobile phone structure which is a critical concern considering the short life span of the mobile phone models.