High-$T_c$ superconducting (HTSC) power cable is one of the interesting parts in power application using HTSC wire. However, its stacked structure makes the current distribution between conducting layers non-uniform due to difference between self inductances of conducting layers and mutual inductances between two conducting layers, which results in lower current transmission capacity of HTSC power cable. In this paper, the transport current distribution between conducting layers was investigated through the numerical analysis for the equivalent circuit of HTSC power cable with a shield layer, and compared with the case of without a shield layer. The transport current distribution due to the increase of the contact resistance in each layer was improved. However, its magnetization loss increased as the contact resistance increased. It was confirmed from the analysis that the shield layer was contributed to the improvement of the current distribution between conducting layers if the winding direction and the pitch length were properly chosen.