Silicon has been widely used in electronic parts as a semiconductor equipment. It, however, requires much effort to grind without microcrack and chipping because of its high hardness and brittleness. So far, many studies for the grinding of engineering ceramics have been done, but not for the grinding of silicon. In this paper, a theoretical analysis on the grinding forces is introduced. Grinding experiments were performed at various grinding conditions including grinding directions (Up grinding and Down grinding), table speeds and depth of cuts. The grinding forces were measured to compare at various grinding conditions. The experimental values agree well with theoretical ones.