- 콜로이드 액적의 증발에 의한 입자 증착에 관한 연구
- ㆍ 저자명
- 위상권,이정용,Wee. Sang-Kwon,Lee. Jung-Yong
- ㆍ 간행물명
- 大韓機械學會論文集. Transactions of the Korean society of mechanical engineers. B. B
- ㆍ 권/호정보
- 2006년|30권 7호|pp.663-670 (8 pages)
- ㆍ 발행정보
- 대한기계학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
The presented study aims to investigate the colloidal droplet deposition caused by evaporation of the liquid. In the numerical analysis, the evaporation is carried out by using different evaporation function intended to obtain different shape of solute deposition. In the experiment, the colloidal droplets of different solvents are placed on a glass plate and the surface profiles are measured after drying the solvents of the droplets to investigate the effect of the solvent evaporation on the final deposition profile. Comparing the surface profiles obtained under different conditions, the optimum drying conditions of colloidal droplets are, determined to obtain uniform surface profiles. The numerical results showed that ring-shaped deposition of solute was formed at the edge of the droplet due to the coffee stain effect and the height of the ring was reduced at the lower evaporation rate. The experiments showed that the boiling point of a solvent was critical to the surface uniformity of the deposition profile and the mixture of solvents with different boiling points influenced the uniformity as well.